MRSI-S-HVM multi-die and photonics bonding

MRSI Systems · Process equipment and thermal control

Purpose: Multi-die assembly needs placement and bonding-condition evaluation, with initial die-attach voids checked separately.
Technical approach: Combines pick-and-place, visual alignment and Z-force with configurable DAF, eutectic, epoxy and top/bottom heating processes.
Scope of use: Integrated photonics, wafer-level packaging, chip-on-wafer and chip-on-interposer, subject to compatible dies, carriers and process modules.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Placement accuracy is not bonded-part yield or void fraction. Photonics assembly does not establish active fiber alignment.
What to prepare
BLNKK suggests dies/carriers, alignment budget, bonding materials/delivery, heat/force/dwell conditions and void maps.
Confirm with the supplier
Confirm modules, force/heating and delivery configuration, then evaluate post-bond shift, voids and cycle time on representative specimens.
Public evidence: Mycronic/MRSI lists multi-die/process assembly and distinguishes alignment modes from the high-force option.

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