MRSI-S-HVM multi-die and photonics bonding
Multi-die assembly needs placement and bonding-condition evaluation, with initial die-attach voids checked separately.
MRSI Systems
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- High-precision die bonding and packaging automation
Applications: Photonics / multi-die packaging · CPO / silicon-photonics optical assembly
Catalog solutions · 2
MRSI-A-L fiber/lens active alignment and attach
Assess coupling loss and displacement across fiber/lens alignment and fixation.
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Public sources
Contact information
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The published mailbox is for MRSI technical service. Use the official inquiry form or sales phone for new equipment, active-alignment or dispensing inquiries. Official source ↗
United States · Headquarters · Sales inquiries
MRSI Systems, LLC — North America / Tewksbury
- Phone
- +1 978 667 9449
Official source ↗Source checked
Mainland China · Supplier office
MRSI Automation (Shenzhen) Co., Ltd.
- Phone
- +86 755 2641 4155
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
MRSI Automation (Shenzhen) Co., Ltd. — East Asia Sales
- Phone
- +86 186 2158 7682
Official source ↗Source checked
More regional contacts (1)
United States · Supplier office · Technical support
MRSI Systems, LLC — Technical Service / 8am–8pm Eastern Time, Monday–Friday
- Phone
- +1 978 758 5897
Official source ↗Source checked
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