Secondary-assembly underfill / sidefill reinforcement

Nagase ChemteX · Material properties and interface engineering

Purpose: BGA thermal-fatigue evaluation needs comparison of reinforcement materials, coverage and processing conditions.
Technical approach: Uses epoxy underfill or sidefill around mounted components, combined with resin delivery, dispensing and cure.
Scope of use: Secondary assembly of board-mounted BGA/QFN components; grade selection depends on gaps, dispensing and rework needs.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Board-level use does not establish chiplet microbump suitability; life benefit, failure location and rework feasibility require specimen validation.
What to prepare
BLNKK suggests BGA/PCB stackup, gaps/joints, coverage, dispense/cure flow and thermal-cycle failure records.
Confirm with the supplier
Confirm grade, flow/cure conditions, material properties and rework method; request test methods/results for comparable structures.
Public evidence: Nagase ChemteX lists reinforcement and solder-life applications without grade-specific fatigue-test conditions.

Contact the supplier

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