Secondary-assembly underfill / sidefill reinforcement
BGA thermal-fatigue evaluation needs comparison of reinforcement materials, coverage and processing conditions.
Nagase ChemteX
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Epoxy resins · adhesives · encapsulation materials
Applications: Board-level BGA / QFN reinforcement · High-frequency hollow / microstructured packages · Resist-strip/seed-interface cleaning comparison · RDL copper seed removal
Catalog solutions · 4
Nagase ChemteX epoxy sheet encapsulant for hollow packages
Hollow/microstructured packages need intended cavities preserved while checking coverage and interface integrity.
Nagase ChemteX N-SC238 dry-film resist stripper
Post-plating interface assessment needs to separate resist residue from electrical defects.
Nagase ChemteX N-CE1 copper seed etchant
RDL short assessment must distinguish residual copper seed from thicker plated bridges.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Nagase ChemteX N-CE1 copper seed etchant · RDL line-to-line shorts after fabrication →
- Nagase ChemteX N-SC238 dry-film resist stripper · High initial RDL via contact resistance →
- Secondary-assembly underfill / sidefill reinforcement · Board-level BGA solder-joint fatigue under thermal cycling →
- Nagase ChemteX epoxy sheet encapsulant for hollow packages · Incomplete mold filling and short shots →
Public sources
Contact information
Contact the supplier directly through its official channels.
Use the listed new-customer form for electronics epoxy materials; a relevant NAGASE Group company may respond. For etchants and resist strippers, choose “Wet Chemicals” on the official product inquiry page. Official source ↗
United States · Supplier office
Nagase ChemteX America LLC — Delaware, Ohio
- Phone
- +1 740 362 4444
Official source ↗Source checked
Taiwan · Supplier office
Nagase ChemteX Corporation — Taiwan Branch Office
- Phone
- +886 2 2773 3668
Official source ↗Source checked
Mainland China · Supplier office
Nagase ChemteX (Wuxi) Corporation
- Phone
- +86 510 8520 0052
Official source ↗Source checked
More regional contacts (1)
Japan · Headquarters
Nagase ChemteX Corporation — Osaka Head Office
- Phone
- +81 6 6535 2582
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.