Nagase ChemteX N-SC238 dry-film resist stripper

Nagase ChemteX · Process equipment and thermal control

Purpose: Post-plating interface assessment needs to separate resist residue from electrical defects.
Technical approach: N-SC238 dissolves/removes negative dry-film resist used in copper plating and permits direct water rinsing.
Scope of use: An exposed-surface stripping candidate; validate the actual resist and Cu/Ti/PI stack on samples.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Vendor low-damage wording does not guarantee every stack or residue/ionic-cleanliness result. This is not buried-interface cleaning, electrical diagnosis or finished-via repair.
What to prepare
BLNKK suggests resist/thickness, stacks and strip/rinse/dry conditions, with surface-loss, ionic-residue and subsequent-resistance comparisons.
Confirm with the supplier
Confirm resist compatibility, process window, bath loading/replacement, rinse/dry method, current SDS and sample evaluation.
Public evidence: The named section describes negative DFR removal, low material damage and example processing.

Contact the supplier

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