Nagase ChemteX N-CE1 copper seed etchant
Nagase ChemteX · Process equipment and thermal control
- Purpose
- RDL short assessment must distinguish residual copper seed from thicker plated bridges.
- Technical approach
- N-CE1 is a hydrogen-peroxide-free copper etchant for seed removal in plating processes.
- Scope of use
- Evaluate Cu redistribution seed etching with stack-specific thickness, linewidth, Ti barrier and bath conditions.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsPublished rates/selectivity do not guarantee every stack, zero CD loss or undercut. Seed removal does not establish repair of thick plated bridges.
What to prepareBLNKK suggests thickness, geometry, barrier and process/rinse records, with residue, linewidth, undercut and electrical comparisons.
Confirm with the supplierConfirm stack-specific window, bath loading/life, barrier effects and rinse requirements, with geometry/electrical sample trials.
- Public evidence
- The named section describes copper-seed/redistribution use and basic performance under specified conditions.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.