QUADRA 3D scanning-probe surface metrology
Nearfield Instruments · Warpage, topography and stress metrology
- Purpose
- Hybrid-bonding preparation needs prebond Cu-pad and dielectric roughness, dishing and erosion assessment.
- Technical approach
- Parallel miniaturized scanning probes capture 3D surface data with probe control, positioning and analysis modes.
- Scope of use
- Wafer process control and probe-accessible prebond surfaces, with probe, imaging mode and sampling scope confirmed.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSurface metrology is not buried-void or chemical analysis. HVM statements and R&D collaboration do not qualify an individual stack.
What to prepareBLNKK suggests pad geometry, surface materials, target topography, CMP/cleaning history, scan coverage and sampling plan.
Confirm with the supplierConfirm probe access, calibration/repeatability, modes and ULSA configuration; request validation on comparable bonding surfaces.
- Public evidence
- The supplier’s 2024 announcement reports HVM deployment; its 2025 imec collaboration develops expanded hybrid-bonding surface metrology.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.