QUADRA 3D scanning-probe surface metrology
Hybrid-bonding preparation needs prebond Cu-pad and dielectric roughness, dishing and erosion assessment.
Nearfield Instruments
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- High-throughput surface metrology for advanced semiconductor structures
Applications: Wafer surfaces / pre-hybrid-bond processing · Recipe-validated bonded wafers
Catalog solutions · 2
AUDIRA acoustic-AFM subsurface feature assessment
Post-bond interface assessment needs localized subsurface information alongside surface topography.
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The manufacturer lists Hermes-Epitek Corporation as its Taiwan commercial agent but does not publish that agent’s phone or email on the contact page. Use the official form and select Sales or General Information to confirm the local contact. Official source ↗
Netherlands · Headquarters
Nearfield Instruments B.V. — Rotterdam Headquarters
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- +31 10 22 33 610
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