AUDIRA acoustic-AFM subsurface feature assessment

Nearfield Instruments · Engineering measurement and characterization

Purpose: Post-bond interface assessment needs localized subsurface information alongside surface topography.
Technical approach: AUDIRA combines acoustic microscopy and AFM sensing to interpret waves through wafer layers and local elasticity changes.
Scope of use: Memory/logic buried features and voids are documented; bonded-wafer recipes require actual-stack/depth validation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Scan step is not detectable-void diameter. Public examples do not qualify every bonded stack or assembled package; validate depth, contrast and false indications.
What to prepare
BLNKK suggests preparing stacks, materials/thicknesses, target depths/defects, accessible surfaces and good/defective specimens with reference analysis.
Confirm with the supplier
Confirm frequencies, sensing modes, recipes and scan areas; discuss representative-defect detection, repeatability and result validation.
Public evidence: Official content explains acoustic/elasticity modes, customer-specific recipes and ordering availability.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.