Nova WMC packaging wafer warpage and thickness metrology

Nova · Warpage, topography and stress metrology

Purpose: Track thickness and warpage changes around thinning, bonding and stacking with wafer- and die-level geometry measurements.
Technical approach: Modular interferometry and reflectometry sensors use adaptive focus. Configured measurements include warp, thickness, bonding-layer TTV and bump topography.
Scope of use: For 2.5D/3D and HBM wafers, framed wafers and panels, subject to the installed sensors and handling configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Geometry maps do not directly establish internal voids or bond strength. Published capabilities do not establish compatibility with every surface, stack or format.
What to prepare
BLNKK suggests preparing substrate/frame dimensions, stack and surface details, expected warp and bump heights, sampling regions and reference samples.
Confirm with the supplier
Confirm sensors, supported formats, layer ranges, focusing and edge exclusions. Agree on repeatability, calibration and exported data for your structure.
Public evidence: The product page lists applications; a separate engineering article describes WMC dual sensors and die mapping. Complete configuration specifications are not published.

Supporting references

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