SOLUTION NAVIGATOREngineering conditions
For “Microbump height variation and coplanarity”, add details that may change the assessment order and check the basis and limits of each candidate.
Engineering conditions
First align prebond point-by-point heights with a local reference, then use maps before and after plating or reshaping and this stack's receiving-side limits to compare material supply or grading. Unknowns remain pending confirmation; “assessable” means only that method inputs are complete, not that a diagnosis has been made or qualification passed.
Live assessment
First add the incoming stage, reference, and coverage.
Unconfirmed: Are height data from an unbonded microbump or copper-pillar array, with plating and reshaping stages recorded?; Do point-by-point heights include a local reference, coordinates, visible coverage, and repeatability?First add maps at the same coordinates before and after processing, with material histories.
Unconfirmed: Are height data from an unbonded microbump or copper-pillar array, with plating and reshaping stages recorded?; Do point-by-point heights include a local reference, coordinates, visible coverage, and repeatability?; Are height, solder-volume, and batch-history data comparable at the same coordinates after plating and after reflow reshaping?First add receiving-surface and tool limitations for this stack.
Unconfirmed: Are height data from an unbonded microbump or copper-pillar array, with plating and reshaping stages recorded?; Do point-by-point heights include a local reference, coordinates, visible coverage, and repeatability?; Are the downstream bonding process's own window, receiving-surface topography, tool parallelism, and Z control traceable?candidate solutions
The order changes only with conditions you confirm. Public information cannot establish suitability for your actual samples.
After one round of comparisons, choose the next step based on actual observations.
Results only change the order of the next investigation; they do not modify condition answers, prove a root cause, or qualify a solution.
Based on reported conditions and public sources. Ready to assess does not establish sample applicability or root cause. Order does not identify the best solution.
First add the incoming stage, reference, and coverage.
First add maps at the same coordinates before and after processing, with material histories.
No result provided. Clarify key conditions before arranging an assessment.
KLA · Zeta-300 Optical Profiler ↗Tool capabilities do not establish detection rates or acceptance criteria at this bump scale. Transparent films, reflectivity and reference datums require confirmation; the tool cannot directly measure actual contact within a closed bonding interface.
Invensas authors / IMAPSource · Development of 2.5D and 3D IC Fabrication and Assembly Technologies ↗Specific structures and assumptions from 2015; do not transfer pitch, TTV, height, inspection accuracy, or bonding recipes, or treat TCB results as reflow-sample validation.
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Related solutions
KLA
Published copper-pillar and UBM coplanarity capabilities can be assessed for this bump field of view and reference.
Basis: KLA：Zeta-300 Optical ProfilerThe reviewed public information describes a workflow. It has not been linked to a specific product in the BLNKK solution catalogue.
BLNKK measurement review request (provider unconfirmed)
Any route with available inputs can proceed with its comparisons; shared process variables still cannot be selected if another evidence segment is missing.
Basis: KLA：Zeta-300 Optical Profiler；Invensas authors / IMAPSource：Development of 2.5D and 3D IC Fabrication and Assembly TechnologiesThe reviewed public information describes a workflow. It has not been linked to a specific product in the BLNKK solution catalogue.
BLNKK engineering review request (provider unconfirmed)
Compare material supply or grading only when both plating / reshaping changes and receiving-side windows are available.
Basis: Invensas authors / IMAPSource：Development of 2.5D and 3D IC Fabrication and Assembly Technologies；KLA：Zeta-300 Optical ProfilerThe reviewed public information describes a workflow. It has not been linked to a specific product in the BLNKK solution catalogue.
MacDermid Alpha Electronics Solutions
Bump-height variation needs pillar-process and measured height-distribution comparisons.
Basis: The named FAQ describes SCP 100 deposition/coplanarity control, without a target-panel uniformity tolerance.Powertech Technology Inc. (PTI)
Bump-height assessment needs defined formation targets and comparisons across wafer locations.
Basis: PTI separately lists solder-bump and copper-pillar pitch/height capabilities and production experience.Kulicke & Soffa
Compare gold-stud formation and height distribution.
Basis: The current page names ATPremier platforms and describes Standard Stud Bump and AccuBump.SUSS MicroTec
Compare resist-pattern exposure/alignment before bump formation and subsequent height assessment.
Basis: The MA12 Gen3 page documents exposure/alignment, dose/gap control and warped-wafer toolkits.Veeco
Bump-process comparisons need resist openings, overlay and sidewalls checked before plating.
Basis: The 2025 announcement identifies uses; the 2019 release explains Unity and pattern-control roles.Plasma-Therm
Packaging metallization review needs deposition/film comparisons before bump formation or die attachment.
Basis: Plasma-Therm identifies authorized refurbishment, upgrades/spares and Mark IV deposition uses.Shin-Etsu MicroSi
Compare plating-mold thickness/openings when investigating bump-height variation.
Basis: The named page and undated Revision 2.3 datasheet document series identity and use.Merck Electronics
Bump-height evaluation needs controlled plating-mask thickness and profile.
Basis: The official Merck/EMD Electronics page identifies AZ and these applications, but provides family-level information.MKS’ Atotech
Compare pillar height and top-profile formation conditions.
Basis: The named page documents an analyzable additive system and adjustable top profiles.Nova
Compare bath-composition changes with copper-pillar formation.
Basis: The product page and named brochure section document bath analysis and replenishment, not individual pillar-uniformity guarantees.Hexagon Manufacturing Intelligence
Height grading needs sampling and acceptance criteria checked.
Basis: Hexagon describes process statistics, capability parameters, visualisation and data interfaces; it does not supply bump-specific acceptance limits.Tokyo Ohka Kogyo Co., Ltd.
Bump-height uniformity comparisons need coordinated checks of resist thickness, opening profiles and plating conditions.
Basis: The named P-BK section lists 20–65 µm resist thickness and process examples; plated heights still need measurement on the intended device.EEJA Ltd.
Gold-bump height comparisons need plating chemistry assessed with resist openings and current distribution.
Basis: The official TANAKA page lists MICROFAB Au bump applications and named grades, sold by EEJA.TATSUTA Electric Wire and Cable Co., Ltd.
Wire-fatigue or wire-bump height comparison needs pads, formation conditions and geometry correlated.
Basis: The official lineup distinguishes TG loop types and TG-B/RB bumping wire, with qualitative series-specific features.Camtek
Map individual pre-bond bump heights against a defined plane and acceptance window.
Basis: Camtek lists bumps down to 2 µm, 50 million bump measurements per wafer, and height, coplanarity, RDL and via functions. These statements do not guarantee precision or throughput for every sample.Onto Innovation
Measure pre-bond bump heights using the actual installed 3Di configuration and a consistent reference plane.
Basis: Official releases from 2021, 2024 and 2025 document G3 optical, infrared and 3Di capabilities. Whole-wafer scanning describes coverage, not guaranteed detection of every defect.Bruker
Measure selected pre-bond bump heights and coplanarity with validated optical surface access.
Basis: The ContourX-500 page describes these uses and automation, with a separate transmissive-media accessory page. Datasheets are available through a request form; their detailed specifications were not read in this review.KLA
Use a confirmed CIRCL-AP/Micro300 metrology configuration to map pre-bond bump height.
Basis: The 2015 launch describes development and production use. The current page lists front, edge, backside and review modules; the 2025 annual report lists CIRCL-AP. Historical module names do not establish today's supplied configuration.Sensofar
Optical height mapping can separate bump-height variation from substrate tilt after actual bump reflectivity and slope validation.
Basis: Current product/specification pages document four technologies and their measurement conditions. Sensofar describes calibration and verification using traceable standards and the applicable ISO 25178 framework; this is not an arbitrary-sample accuracy guarantee.Filmetrics, a KLA company
The documented bump-coplanarity measurement supports height/distribution review after subtracting datum tilt; select objective and surface-compatible mode.
Basis: The current page and 2022 brochure describe bump coplanarity, surface bow and automated stages; stage travel does not guarantee whole-wafer coverage.Koh Young Technology
3D micro-solder measurements can support bump-height/coplanarity review; confirm the selected Meister S recipe and actual pitch before claiming detectability.
Basis: The product page describes 0.1 µm Z resolution, while the 2025 application article explains solder/flux profiling and warp compensation. Resolution is not accuracy, and series-level production-qualification claims do not qualify every customer product.ACM Research
Panel bump plating enables field, flow and recipe comparisons against measured height variation.
Basis: The product page lists panel sizes, configurations and uniformity indices; the 2026 application article discusses glass/organic panels. Their warpage-handling values differ, so they are not a common customer-panel acceptance specification.Confovis
Optical 3D surface measurements can map bump heights after validating reflection, occlusion and repeatability.
Basis: The AOI Dual page explains the two-sensor workflow; Confovis’ bump application page lists height, coplanarity and volume measurements.DuPont
Compare the complete INTERVIA 9000 plating formulation against pillar height and top shape; distinguish additive SKUs from the bath system.
Basis: The product page describes these applications; a 2025 announcement confirms separation from DuPont. Publicly read content does not supply a complete recipe or customer-pattern qualification.Merck Electronics
Post-plating resist removal can remove residue that biases height inspection or later bonding; compare staged surfaces.
Basis: The manufacturer’s description confirms thick-resist applications. No readable complete recipe, stripping-rate or compatibility window was provided; request current technical data.Micross Components
Contract bump fabrication enables process/geometry comparisons with agreed height maps and coupons.
Basis: The website and 2024 WLP flyer document bumping, RDL and custom test vehicles. They do not qualify customer height distribution or yield.Nova
Configured optical sensors can map bump heights after calibrating the actual warped-wafer surfaces.
Basis: The product page lists applications; a separate engineering article describes WMC dual sensors and die mapping. Complete configuration specifications are not published.References
The manufacturer lists capabilities for measuring copper-pillar and UBM heights, metal-contact coplanarity, and surface or edge profiles.
Limit: Tool capabilities do not establish detection rates or acceptance criteria at this bump scale. Transparent films, reflectivity and reference datums require confirmation; the tool cannot directly measure actual contact within a closed bonding interface.The research example separates prebond coplanarity, solder volume and collapse, tool parallelism, and Z control; its flip-chip and microbump diagrams compare contact and bridging windows.
Limit: Specific structures and assumptions from 2015; do not transfer pitch, TTV, height, inspection accuracy, or bonding recipes, or treat TCB results as reflow-sample validation.The named FAQ describes SCP 100 deposition/coplanarity control, without a target-panel uniformity tolerance.
Limit: Scope and limitations Published deposition speed does not guarantee pattern-specific height uniformity. Chemistry neither measures height nor automatically levels a panel; other PLP products’ features do not transfer. What to prepare BLNKK suggests recording mask/density, seed, bath, current, agitation and panel contacts, with location-matched height measurements. Confirm with the supplier Confirm pattern/thickness range, process window, resist/seed compatibility, and methods for validating panel- and die-level coplanarity.PTI separately lists solder-bump and copper-pillar pitch/height capabilities and production experience.
Limit: Scope and limitations Published pitch/height capabilities do not guarantee whole-wafer uniformity. Formation is not height metrology or repair of existing defective bumps. What to prepare BLNKK suggests preparing wafer/pad data, UBM/passivation, target pitch/diameter/height, sampling locations and baseline height maps. Confirm with the supplier Confirm geometry-specific rules, formation/acceptance conditions, measurement definitions and sampling; discuss location variation and assembly requirements.The current page names ATPremier platforms and describes Standard Stud Bump and AccuBump.
Limit: Scope and limitations Gold-stud capabilities do not transfer to Cu pillars/solder balls. Public height claims are not universal coplanarity acceptance. What to prepare BLNKK suggests preparing gold wire, pads, capillaries, pitch, target heights and height/bond-strength comparisons. Confirm with the supplier Confirm model, formation/shaping configuration, material/process windows and height-sampling/bond-quality validation.The MA12 Gen3 page documents exposure/alignment, dose/gap control and warped-wafer toolkits.
Limit: Scope and limitations Exposure capability does not establish uniform plated-bump heights; specialized optics/toolkits are not universally installed. What to prepare BLNKK suggests preparing resist/thickness, masks/openings, exposure/development conditions, wafer shape and subsequent plated-height data. Confirm with the supplier Confirm exposure/alignment modes, optics/tooling, supported thickness/warpage and pattern/downstream validation.The 2025 announcement identifies uses; the 2019 release explains Unity and pattern-control roles.
Limit: Scope and limitations Exposure is not plating/reflow or bridge repair. Announcements do not establish stack-specific resist, overlay or formed-bump acceptance windows. What to prepare BLNKK suggests preparing resist stacks, openings/sidewalls, overlay maps, exposure settings and downstream plating/reflow/bump measurements. Confirm with the supplier Confirm optics/wafer configurations, resist exposure windows, overlay definitions and pattern acceptance; discuss correlation with height and bridging inspections.Plasma-Therm identifies authorized refurbishment, upgrades/spares and Mark IV deposition uses.
Limit: Scope and limitations Do not transfer all Mark IV capabilities to Mark II. Refurbishment does not qualify arbitrary UBM recipes; verify chambers, targets and contamination control. What to prepare BLNKK suggests preparing metal stacks, wafer/thickness, film thickness/uniformity, adhesion/contact-resistance needs, contamination and downstream forming conditions. Confirm with the supplier Confirm model, refurbishment/upgrades, chambers/targets, availability/support and sample-film/downstream acceptance.The named page and undated Revision 2.3 datasheet document series identity and use.
Limit: Scope and limitations Resist does not measure or guarantee plated-height uniformity. Series examples do not qualify every grade or wafer process. What to prepare BLNKK suggests preparing target heights/openings, film thickness, lithography, plating/strip conditions and profile/height/residue comparisons. Confirm with the supplier Confirm grade, equipment/bath compatibility, process windows and representative-wafer profile/strip validation.The official Merck/EMD Electronics page identifies AZ and these applications, but provides family-level information.
Limit: Scope and limitations The page does not specify grade-level thickness or process windows. Family characteristics do not establish suitability or bump coplanarity. What to prepare BLNKK suggests preparing opening dimensions, target thickness, exposure/development and bath conditions, plus pre-plating profiles and plated-height data. Confirm with the supplier Ask which grade, bath compatibility and stripping method are appropriate, and which technical data and samples are available for validation.Official page identifies pillar chemistry, additives and profile adjustment.
Limit: Scope and limitations Vendor uniformity/void-free descriptions do not guarantee target-wafer height, coplanarity or defects, or every plater/pattern. What to prepare BLNKK suggests resist openings, seed, current distribution and bath analysis, with per-pillar height/profile and wafer-wide defect comparisons. Confirm with the supplier Confirm plater/pattern windows, additive analysis/control, profile/height criteria and actual-wafer validation.The product page and named brochure section document bath analysis and replenishment, not individual pillar-uniformity guarantees.
Limit: Scope and limitations Concentration alone does not establish local current, individual pillar height or final coplanarity. Cross-check formation measurements. What to prepare BLNKK suggests collecting formulation, sampling locations, calibration/replenishment records and timestamps alongside pillar-height and morphology data. Confirm with the supplier Confirm analytes, method validation, sampling/replenishment delay, plating-tool/facility interfaces and maintenance conditions.Hexagon describes process statistics, capability parameters, visualisation and data interfaces; it does not supply bump-specific acceptance limits.
Limit: Scope and limitations The software neither measures bumps nor establishes product limits. Capability indices do not replace individual-defect rules or automatically authorize bonding. What to prepare BLNKK suggests preparing coordinates/batches, raw heights, measurement methods, sampling/grouping and approved acceptance criteria. Confirm with the supplier Confirm formats and interfaces, assessment strategies, distribution/outlier treatment and how reports map to existing release rules.The named P-BK section lists 20–65 µm resist thickness and process examples; plated heights still need measurement on the intended device.
Limit: Scope and limitations Resist profiles do not guarantee plated-height uniformity. Examples are not universal bath recipes, and resist cannot repair completed bumps. What to prepare BLNKK suggests gathering target geometry, layout density, thickness/opening measurements, lithography histories, bath/current conditions and height distributions. Confirm with the supplier Confirm grade, thickness, adhesion, exposure/development and bath compatibility, plus stripping and sample height/residue acceptance.The official TANAKA page lists MICROFAB Au bump applications and named grades, sold by EEJA.
Limit: Scope and limitations It is not a general copper-pillar or solder-bump formulation or a repair for completed bumps. Chemistry alone does not ensure uniform wafer-level height. What to prepare BLNKK suggests preparing seed/resist structures, target heights, bath and current/flow records, with height maps and surface comparisons. Confirm with the supplier Confirm the grade, bath management and process window, and sample validation of height, adhesion and contact performance.The official lineup distinguishes TG loop types and TG-B/RB bumping wire, with qualitative series-specific features.
Limit: Scope and limitations Stable-loop or bump-height descriptions do not qualify the actual height distribution or fatigue life. Properties are not interchangeable across TG grades. What to prepare BLNKK suggests preparing pad metallurgy, wire/loop or bump geometry, tooling and process history, with height maps, pull/shear failure locations and cycling loads. Confirm with the supplier Confirm the grade, ball/cut/bonding window and assessment of height consistency, interface strength and cyclic reliability.Camtek lists bumps down to 2 µm, 50 million bump measurements per wafer, and height, coplanarity, RDL and via functions. These statements do not guarantee precision or throughput for every sample.
Limit: Scope and limitations Bump-size capability is not a same-size defect-detection guarantee or full-field thermal-warpage measurement. Validate precision, coverage and cycle time on the actual materials, structures and recipe. What to prepare Bring wafer dimensions, interconnect geometry/CAD, surface materials, target defects and tolerances, plus reference measurements or representative good/bad samples. Confirm with the supplier Confirm precision, repeatability, detection/false-call performance and wafer cycle time. For hybrid bonding, ask for model-specific surface/defect coverage and validation evidence.Official releases from 2021, 2024 and 2025 document G3 optical, infrared and 3Di capabilities. Whole-wafer scanning describes coverage, not guaranteed detection of every defect.
Limit: Scope and limitations This entry covers published G3 capabilities, not EchoScan acoustic void inspection or pad-dishing capabilities of other products. Detectability of a particular defect needs sample validation. What to prepare BLNKK suggests preparing sample structures, representative defects, bump dimensions and height ranges, and existing measurement results. Separate surface inspection, height metrology and subsurface inspection needs. Confirm with the supplier Confirm optical, IR or 3Di configuration, sample compatibility, detection thresholds and classification settings. Ask how representative samples will be used to assess detection, false calls, repeatability and throughput.The ContourX-500 page describes these uses and automation, with a separate transmissive-media accessory page. Datasheets are available through a request form; their detailed specifications were not read in this review.
Limit: Scope and limitations Surface topography does not directly diagnose buried voids or delamination. Transmissive-media accessories are available, but do not imply that a thermal chamber is standard or that a specified reflow-warpage measurement is supported without configuration review. What to prepare Bring sample materials and surface condition, measurement area, expected height range, coplanarity definition and repeatability targets. For measurements at temperature, add the temperature profile and viewing-window details. Confirm with the supplier Confirm objectives, stitching, fixtures and analysis software for the required range, and test repeatability on representative samples. For measurements through a cover or chamber window, confirm accessory compatibility and calibration.The 2015 launch describes development and production use. The current page lists front, edge, backside and review modules; the 2025 annual report lists CIRCL-AP. Historical module names do not establish today's supplied configuration.
Limit: Scope and limitations Handling warped substrates does not establish warpage measurement through a thermal cycle. Modules and recipes cover different defects and measurements; surface inspection does not directly diagnose every buried bonding defect. What to prepare Bring wafer size/thickness, carrier/bonding state and warp range, plus defect types, affected surfaces, critical dimensions and inspection points. Include representative samples and throughput targets. Confirm with the supplier Confirm current modules, handling limits and 2D/3D measurement coverage. Use samples to discuss sensitivity, false calls, repeatability and throughput, with a plan for data integration and recipe validation.Current product/specification pages document four technologies and their measurement conditions. Sensofar describes calibration and verification using traceable standards and the applicable ISO 25178 framework; this is not an arbitrary-sample accuracy guarantee.
Limit: Scope and limitations Surface profiling does not replace inspection of buried package voids or delamination. Signal availability and uncertainty depend on the objective, reflection/scattering, slope and setup; film analysis also depends on the material and optical model. What to prepare BLNKK suggests preparing bump dimensions/pitch, surface materials, height references and regions of interest, together with repeatability, tilt-removal and acceptance criteria for representative sample trials. Confirm with the supplier Confirm suitable modes, objectives and scan coverage, uncertainty on the actual features, and included bump-analysis plugins, data exports and calibration records.The current page and 2022 brochure describe bump coplanarity, surface bow and automated stages; stage travel does not guarantee whole-wafer coverage.
Limit: Scope and limitations Accessible optical signals are needed; buried or obscured bumps need other assessment. Vertical resolution is not accuracy across a stitched surface. What to prepare BLNKK suggests preparing bump geometry/materials, sample height and measurement area, plus coplanarity references, leveling rules and calibration standards. Confirm with the supplier Confirm objectives, imaging/stitching options and sample-based reflectivity, slope, repeatability, coverage and fixture deformation.The product page describes 0.1 µm Z resolution, while the 2025 application article explains solder/flux profiling and warp compensation. Resolution is not accuracy, and series-level production-qualification claims do not qualify every customer product.
Limit: Scope and limitations Optical measurement requires surface visibility and an appropriate inspection procedure; it does not directly inspect buried interfaces. Published Z resolution does not establish equal accuracy for every material, pitch or production speed. What to prepare BLNKK recommends preparing deposit dimensions/pitch, solder and flux types, substrate warp, carriers, line cycle time and reference/defective samples. Include existing measurement references and acceptance rules to evaluate false calls and missed defects. Confirm with the supplier Confirm Meister S camera, optics and handling options, then validate height, volume and transparent-flux measurements. Discuss warp compensation, repeatability, export and software for process feedback without assuming S+ features are included.The product page lists panel sizes, configurations and uniformity indices; the 2026 application article discusses glass/organic panels. Their warpage-handling values differ, so they are not a common customer-panel acceptance specification.
Limit: Scope and limitations Published uniformity indices do not establish bump-height precision for every pattern. Product and application pages give different warpage values; confirm definitions, configuration and measurement state rather than choosing the larger value. What to prepare BLNKK recommends preparing panel material, size/warp, seed layer, resist/pattern distribution, target deposits and existing chemistry. Include thickness, bump-height and defect-distribution references to plan recipe/handling validation. Confirm with the supplier Confirm current panel/warpage acceptance, metal processes, prewet/cleaning and chamber configurations. Discuss index calculations, metrology/sampling, pattern-density and edge effects, and throughput test conditions.The AOI Dual page explains the two-sensor workflow; Confovis’ bump application page lists height, coplanarity and volume measurements.
Limit: Scope and limitations Surface data does not establish buried voids. Typical scan time is not total inspection cycle; resolution/repeatability need sample validation. What to prepare BLNKK suggests bump dimensions/layout, materials/finish, reference plane, height criteria and representative good/defective samples. Confirm with the supplier Confirm reflectivity/occlusion suitability, two-stage recipes, repeatability/uncertainty and full cycle including detailed inspection.The product page describes these applications; a 2025 announcement confirms separation from DuPont. Publicly read content does not supply a complete recipe or customer-pattern qualification.
Limit: Scope and limitations An individual additive is not a complete bath. Mixed item names on the page require clarification; shared-bath claims do not qualify uniformity, filling or supply. What to prepare BLNKK recommends preparing pattern/resist/seed geometry, target deposits, current bath and electrical/agitation conditions. Include height and thickness distributions for comparison planning. Confirm with the supplier Ask Qnity for exact SKUs, bath components, current technical data and regional supply. Confirm equipment compatibility, additive monitoring and shared-bath operating/validation conditions.The manufacturer’s description confirms thick-resist applications. No readable complete recipe, stripping-rate or compatibility window was provided; request current technical data.
Limit: Scope and limitations Stripping does not correct plated bump height. Seed-layer etching or temporary-adhesive removal cannot be assumed; validate resist/metal compatibility on coupons. What to prepare BLNKK recommends preparing resist grade/thickness, exposure/bake history, bump metals and exposed materials. Keep before/after images, residue and material-loss references. Confirm with the supplier Confirm current AP7900A technical/safety data, temperature/time, equipment and rinsing. Request representative material compatibility, bath-maintenance and validation guidance.The website and 2024 WLP flyer document bumping, RDL and custom test vehicles. They do not qualify customer height distribution or yield.
Limit: Scope and limitations The named 200 mm line does not establish all Micross formats. Separate fine-pitch metal-bond demonstrations are not routine specifications for this bumping service. What to prepare BLNKK recommends preparing wafer format, pad metals/pitch, bump/RDL stacks, target height and volume. Include height measurement, reliability and yield acceptance needs. Confirm with the supplier Confirm the assigned line, wafer format, design rules, materials and processes. Agree on metrology, coupons, delivered records, qualification and rework conditions.The product page lists applications; a separate engineering article describes WMC dual sensors and die mapping. Complete configuration specifications are not published.
Limit: Scope and limitations Geometry maps do not directly establish internal voids or bond strength. Published capabilities do not establish compatibility with every surface, stack or format. What to prepare BLNKK suggests preparing substrate/frame dimensions, stack and surface details, expected warp and bump heights, sampling regions and reference samples. Confirm with the supplier Confirm sensors, supported formats, layer ranges, focusing and edge exclusions. Agree on repeatability, calibration and exported data for your structure.Before assessment