Authorized refurbished MRC Eclipse packaging PVD

Plasma-Therm · Process equipment and thermal control

Purpose: Packaging metallization review needs deposition/film comparisons before bump formation or die attachment.
Technical approach: The described Eclipse Mark IV sputters metals in vacuum-isolated chambers with wafer transport and Epoch control.
Scope of use: Authorized refurbished Mark II/IV supply requires tool-specific confirmation; documented Mark IV uses include C4/die attach and thin-silicon/compound wafers.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Do not transfer all Mark IV capabilities to Mark II. Refurbishment does not qualify arbitrary UBM recipes; verify chambers, targets and contamination control.
What to prepare
BLNKK suggests preparing metal stacks, wafer/thickness, film thickness/uniformity, adhesion/contact-resistance needs, contamination and downstream forming conditions.
Confirm with the supplier
Confirm model, refurbishment/upgrades, chambers/targets, availability/support and sample-film/downstream acceptance.
Public evidence: Plasma-Therm identifies authorized refurbishment, upgrades/spares and Mark IV deposition uses.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.