Ultra ECP ap-p panel-level plating
ACM Research · Process equipment and thermal control
- Purpose
- Panel bump and RDL plating must address deposition uniformity, pattern distribution and handling. Ultra ECP ap-p provides panel-level plating for evaluating metal-formation conditions.
- Technical approach
- Horizontal plating chambers and electric-field control deposit metals, with prewet, cleaning, alignment and panel handling. Metal processes and chamber count depend on the selected configuration.
- Scope of use
- The system targets FOPLP pillar, bump and RDL plating. Published formats include 510 × 515 and 600 × 600 mm panels; material, seed-layer, pattern and warpage compatibility need product-specific confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsPublished uniformity indices do not establish bump-height precision for every pattern. Product and application pages give different warpage values; confirm definitions, configuration and measurement state rather than choosing the larger value.
What to prepareBLNKK recommends preparing panel material, size/warp, seed layer, resist/pattern distribution, target deposits and existing chemistry. Include thickness, bump-height and defect-distribution references to plan recipe/handling validation.
Confirm with the supplierConfirm current panel/warpage acceptance, metal processes, prewet/cleaning and chamber configurations. Discuss index calculations, metrology/sampling, pattern-density and edge effects, and throughput test conditions.
- Public evidence
- The product page lists panel sizes, configurations and uniformity indices; the 2026 application article discusses glass/organic panels. Their warpage-handling values differ, so they are not a common customer-panel acceptance specification.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.