Ultra ECP ap-p panel-level plating
Panel bump and RDL plating must address deposition uniformity, pattern distribution and handling. Ultra ECP ap-p provides panel-level plating for evaluating metal-formation conditions.
ACM Research
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Wafer cleaning · plating · furnace and advanced packaging equipment
Applications: FOPLP panels · Silicon-wafer TSV / via surfaces · Post-attach FOWLP / chiplet gaps · TSV / fan-out metal planarization
Catalog solutions · 4
Ultra C SAPS TSV/via megasonic cleaning
Particles/residue before TSV/via deposition call for comparing cleaning conditions and structural tolerance ahead of interface evaluation.
Ultra C vac narrow-gap flux cleaning
Evaluate flux residues in narrow post-reflow gaps before selecting a pre-underfill cleaning process.
Ultra SFP copper-overburden removal and planarization
Compare copper-overburden removal and subsequent planarization after TSV fill or fan-out RDL processing.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Ultra C vac narrow-gap flux cleaning · Underfill voids and post-cure delamination in large multi-die packages →
- Ultra SFP copper-overburden removal and planarization · TSV reveal height and backside coplanarity →
- Ultra C SAPS TSV/via megasonic cleaning · Seams and voids in TSV copper fill →
- Ultra ECP ap-p panel-level plating · Microbump height variation and coplanarity →
Public sources
Contact information
Contact the supplier directly through its official channels.
United States · General contact
ACM Research — North America / Europe
- Phone
- +1 510 445 3700
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
ACM Research Shanghai
- Phone
- +86 21 5027 6550
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
Supplier updates and ownership →
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.