Ultra C SAPS TSV/via megasonic cleaning

ACM Research · Process equipment and thermal control

Purpose: Particles/residue before TSV/via deposition call for comparing cleaning conditions and structural tolerance ahead of interface evaluation.
Technical approach: Alternating megasonic phases, a moving/tilting transducer and wafer rotation distribute acoustic energy through selected dilute chemistry.
Scope of use: Listed post-via-etch, pre-barrier and high-aspect-ratio TSV cleaning on wet-process-compatible wafers/stacks.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Energy-distribution control does not guarantee damage-free treatment of every pattern. Particle removal cannot qualify via filling or insulation; model-specific acoustic/cleaning options need confirmation.
What to prepare
BLNKK suggests documenting geometry, residue, exposed metals, chemistry and acoustic conditions, with before/after residue, corrosion, roughness and pattern-damage checks.
Confirm with the supplier
Confirm models, acoustic/angle and chemical windows, options, sample trials and cleaning/damage interpretation criteria.
Public evidence: The official body describes the mechanism, named uses and model/options; it does not qualify the actual sample’s damage response.

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