DYNASTRIP AP7900A thick photoresist remover

Merck Electronics · Material properties and interface engineering

Purpose: Bump and copper-pillar processes require thick-resist removal and checks of residues/exposed materials. AP7900A is a candidate WLP stripping formulation.
Technical approach: A formulated chemical remover strips thick resist. Confirm temperature, time and cleaning conditions against the resist, bake history and exposed materials.
Scope of use: Named uses include WLP, lead-free solder bumping, micro-bumps and copper pillars. Other DYNASTRIP grades’ properties are not assigned to AP7900A.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Stripping does not correct plated bump height. Seed-layer etching or temporary-adhesive removal cannot be assumed; validate resist/metal compatibility on coupons.
What to prepare
BLNKK recommends preparing resist grade/thickness, exposure/bake history, bump metals and exposed materials. Keep before/after images, residue and material-loss references.
Confirm with the supplier
Confirm current AP7900A technical/safety data, temperature/time, equipment and rinsing. Request representative material compatibility, bath-maintenance and validation guidance.
Public evidence: The manufacturer’s description confirms thick-resist applications. No readable complete recipe, stripping-rate or compatibility window was provided; request current technical data.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.