DYNASTRIP AP7900A thick photoresist remover
Bump and copper-pillar processes require thick-resist removal and checks of residues/exposed materials. AP7900A is a candidate WLP stripping formulation.
Merck Electronics
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- Semiconductor materials · dielectrics · patterning and packaging solutions
Applications: WLP / bumps / copper pillars · Silicone temporary-bond residues · Bump mask/formation comparison
Catalog solutions · 3
Dynasolve 219 silicone temporary-bond material removal
Plan removal and compatibility trials for temporary-bonding residue confirmed to be cured silicone.
Merck AZ thick-film plating resists
Bump-height variation should be evaluated alongside resist-mold thickness and opening profile when comparing bump-forming processes.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
Public sources
Contact information
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The Taiwan head office and advanced-materials Hsinchu plant publish the same group email; confirm the team responsible for your product. For electronic materials, you can also use the Electronics form and select your location and relevant field, such as thin films, planarization or patterning. The Germany headquarters contact is a general corporate contact. The business operates under EMD in the U.S. and Canada and is distinct from Merck & Co. Official source ↗
Taiwan · Supplier office
Merck Taiwan — Taipei Head Office (Nangang)
- Phone
- +886 2 2162 1111
Official source ↗Source checked
Germany · Headquarters
Merck KGaA, Darmstadt, Germany — General Corporate Contact
- Phone
- +49 6151 72 0
Official source ↗Source checked
Taiwan · Supplier office
Merck Advanced Materials — Hsinchu Plant
- Phone
- +886 3 597 0885
Official source ↗Source checked
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