Dynasolve 219 silicone temporary-bond material removal

Merck Electronics · Material properties and interface engineering

Purpose: Plan removal and compatibility trials for temporary-bonding residue confirmed to be cured silicone.
Technical approach: Low surface tension promotes penetration where exposed silicone area is small, supporting dissolution and removal.
Scope of use: For silicone-based temporary bonding; confirm the actual adhesive, cure state, residue geometry and substrate stack.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Do not extend the claim to arbitrary polymers or all metal/dielectric surfaces. Clean appearance alone does not establish suitability for the next bonding step.
What to prepare
BLNKK suggests preparing adhesive/cure history, residue thickness/exposed area, surface materials and downstream requirements for coupon comparisons of removal, material changes and residue.
Confirm with the supplier
Request current TDS/SDS, supported adhesives and process guidance. Confirm soak/rinse/dry conditions, stack compatibility, downstream surface validation and availability.
Public evidence: The official description states these uses but supplies no recipe, operating conditions or compatibility data for the proposed stack.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.