Merck AZ thick-film plating resists

Merck Electronics · Material properties and interface engineering

Purpose: Bump-height variation should be evaluated alongside resist-mold thickness and opening profile when comparing bump-forming processes.
Technical approach: AZ thick-film resists define patterned conductive structures. The family page lists TSV, RDL and bumping applications and adjustable profiles.
Scope of use: A candidate resist for patterning before bump plating; select the grade for the geometry, film thickness and plating chemistry.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
The page does not specify grade-level thickness or process windows. Family characteristics do not establish suitability or bump coplanarity.
What to prepare
BLNKK suggests preparing opening dimensions, target thickness, exposure/development and bath conditions, plus pre-plating profiles and plated-height data.
Confirm with the supplier
Ask which grade, bath compatibility and stripping method are appropriate, and which technical data and samples are available for validation.
Public evidence: The official Merck/EMD Electronics page identifies AZ and these applications, but provides family-level information.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.