ContourX-500 non-contact 3D surface and coplanarity metrology
Bruker · Warpage, topography and stress metrology
- Purpose
- Die, bump and package surfaces require 3D measurements of height, flatness and coplanarity that a 2D image alone cannot provide.
- Technical approach
- Non-contact white-light interferometry captures 3D surface geometry, with encoded XY positioning and automated tip/tilt and illumination adjustment.
- Scope of use
- Bruker lists post-CMP die flatness, bump height and coplanarity, surface defects and critical dimensions. The usable measurement range depends on the sample and optical configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSurface topography does not directly diagnose buried voids or delamination. Transmissive-media accessories are available, but do not imply that a thermal chamber is standard or that a specified reflow-warpage measurement is supported without configuration review.
What to prepareBring sample materials and surface condition, measurement area, expected height range, coplanarity definition and repeatability targets. For measurements at temperature, add the temperature profile and viewing-window details.
Confirm with the supplierConfirm objectives, stitching, fixtures and analysis software for the required range, and test repeatability on representative samples. For measurements through a cover or chamber window, confirm accessory compatibility and calibration.
- Public evidence
- The ContourX-500 page describes these uses and automation, with a separate transmissive-media accessory page. Datasheets are available through a request form; their detailed specifications were not read in this review.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.