ContourX-500 non-contact 3D surface and coplanarity metrology
Die, bump and package surfaces require 3D measurements of height, flatness and coplanarity that a 2D image alone cannot provide.
Bruker
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- 3D optical metrology · X-ray microscopy · materials characterization
Applications: Dies, bumps and package surfaces · Measurable polymer / organic residues · Prebond surfaces and wafer roughness · TSV material/reference specimens · Solder/polymer constituents
Catalog solutions · 5
LUMOS II FT-IR residue identification
Unknown residues need chemical comparisons before narrowing cleaning and material-investigation options.
Dimension HPI nanoscale surface roughness metrology
Prebond surfaces need local roughness, step-height and defect-topography evidence for cleaning/planarization comparisons.
D8 DISCOVER crystalline-film stress comparison
Add crystalline-phase and strain comparisons to TSV stress investigations, separately from whole-structure models.
Hysitron TI 980 local constituent mechanics
Add local solder or underfill mechanical data to BGA fatigue comparisons, separately from joint geometry and cycling results.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Assessment of pre-bond topography with AFM/AFP · Pre-bond surface readiness and release for hybrid bonding →
- Dimension HPI nanoscale surface roughness metrology · Pre-bond surface readiness and release for hybrid bonding →
- D8 DISCOVER crystalline-film stress comparison · Stress around TSVs and device keep-out design →
- LUMOS II FT-IR residue identification · Temporary-bond residue and cleaning compatibility →
- ContourX-500 non-contact 3D surface and coplanarity metrology · Microbump height variation and coplanarity →
- Hysitron TI 980 local constituent mechanics · Board-level BGA solder-joint fatigue under thermal cycling →
Public sources
- Product information: ContourX-500 non-contact 3D surface and coplanarity metrology
- Public reference: it/meta/forms/bns-form-pages/brochures/som/contourx-100.html
- Product information: LUMOS II FT-IR residue identification
- Technical reference: Dimension HPI nanoscale surface roughness metrology (PDF)
- Product information: D8 DISCOVER crystalline-film stress comparison
- Product information: Hysitron TI 980 local constituent mechanics
Contact information
Contact the supplier directly through its official channels.
Taiwan · Supplier office · Sales inquiries
Bruker Taiwan Co Ltd — Nano Surfaces and Mechanical Testing Sales
- BNS.Asia@bruker.com
- Phone
- +886 3 560 1212
Official source ↗Source checked
Taiwan · Supplier office · Technical support
Bruker Taiwan Co Ltd — Nano Surfaces and Mechanical Testing Support
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Bruker Taiwan Co Ltd — Infrared, Near Infrared and Raman Spectroscopy Sales
- Phone
- +886 2 8698 1212
Official source ↗Source checked
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