Dimension HPI nanoscale surface roughness metrology
Bruker · Nanoscale surface metrology
- Purpose
- Prebond surfaces need local roughness, step-height and defect-topography evidence for cleaning/planarization comparisons.
- Technical approach
- Dimension HPI uses AFM probes with configuration-dependent contact, Tapping or PeakForce Tapping modes and automated recipes.
- Scope of use
- Accessible exposed surfaces with qualified mounting and scan locations; distinguish HPI from Pro sample/scan configurations.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsLocal AFM does not establish whole-wafer cleanliness, chemistry or bonding acceptance. Probe, scan and environment affect results. Pro’s 300 mm configuration must not be assigned to HPI.
What to prepareBLNKK suggests preparing materials, sample size/mounting, locations, roughness definitions and scan sizes, with preparation and control-sample records.
Confirm with the supplierConfirm current availability, HPI head/sample capacity, probe/mode, calibration and processing; agree on sampling and acceptance methods.
- Public evidence
- The B088 Rev. A0 brochure, marked ©2019, names HPI roughness, height/depth and defect-review capabilities.
Contact the supplier
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.