Hysitron TI 980 local constituent mechanics

Bruker · Engineering measurement and characterization

Purpose: Add local solder or underfill mechanical data to BGA fatigue comparisons, separately from joint geometry and cycling results.
Technical approach: TI 980 compares local response through quasi-static/dynamic nanoindentation, nanoscratch and XPM property mapping.
Scope of use: Consider prepared, representative material surfaces. Confirm methods for the actual solder, underfill or film.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Local hardness/modulus cannot directly predict joint thermal-fatigue life. Account for indentation depth, substrate and time effects.
What to prepare
BLNKK suggests materials, preparation/locations, probe/depth settings and temperature/time conditions alongside joint geometry and cycling evidence.
Confirm with the supplier
Confirm modes, probes/calibration, sample limitations and analysis assumptions; check environmental or other upgrades separately.
Public evidence: The TI 980 page lists base testing modes and in-situ SPM imaging, separately from upgrades.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.