Dragonfly G3 2D/3D inspection and metrology for advanced packaging
Onto Innovation · Warpage, topography and stress metrology
- Purpose
- Advanced packaging needs checks for fine RDL defects, process residues and bump height. HBM and bonded, thinned wafers also require stacked-die position or subsurface-crack inspection.
- Technical approach
- Dragonfly G3 combines brightfield, darkfield and Clearfind 2D inspection with 3D bump metrology and automated defect classification. Published additions include infrared subsurface inspection and 3Di bump metrology.
- Scope of use
- Published G3 applications include advanced-package RDL, photoresist or chemical residues, bumps, HBM and microcracks in bonded, thinned wafers. The required modules and configuration depend on the target defect.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsThis entry covers published G3 capabilities, not EchoScan acoustic void inspection or pad-dishing capabilities of other products. Detectability of a particular defect needs sample validation.
What to prepareBLNKK suggests preparing sample structures, representative defects, bump dimensions and height ranges, and existing measurement results. Separate surface inspection, height metrology and subsurface inspection needs.
Confirm with the supplierConfirm optical, IR or 3Di configuration, sample compatibility, detection thresholds and classification settings. Ask how representative samples will be used to assess detection, false calls, repeatability and throughput.
- Public evidence
- Official releases from 2021, 2024 and 2025 document G3 optical, infrared and 3Di capabilities. Whole-wafer scanning describes coverage, not guaranteed detection of every defect.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.