Firefly G5 panel-level packaging inspection and 3D metrology
Inspect residue, pattern and embedded defects on advanced IC substrates and packaging panels, alongside critical 3D dimensions.
Onto Innovation
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Advanced packaging inspection · 2D / 3D metrology · process control
Applications: Advanced IC substrates and panel-level packaging · RDL / bump metrology / HBM / bonded and thinned wafers · Bonded die / wafer interfaces · Panel RDL / resist patterns
Catalog solutions · 4
Dragonfly G3 2D/3D inspection and metrology for advanced packaging
Advanced packaging needs checks for fine RDL defects, process residues and bump height. HBM and bonded, thinned wafers also require stacked-die position or subsurface-crack inspection.
EchoScan immersion-free bond-void inspection
Evaluate interface-void inspection after die or wafer bonding.
JetStep panel RDL projection lithography
When die shift affects RDL alignment, compare panel exposure and the workflow that incorporates measured die positions.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- EchoScan void detection system · Local interface voids after hybrid bonding →
- Dragonfly G3 2D / 3D inspection and metrology · Local interface voids after hybrid bonding →
- EchoScan immersion-free bond-void inspection · Local interface voids after hybrid bonding →
- JetStep panel RDL projection lithography · Post-mold die shift and RDL misalignment in fan-out packages →
- Firefly G5 panel-level packaging inspection and 3D metrology · Post-mold die shift and RDL misalignment in fan-out packages →
- JetStep panel-handling option evaluation · Fan-out panel warpage during chucking and handling →
- Dragonfly G3 2D/3D inspection and metrology for advanced packaging · Microbump height variation and coplanarity →
Public sources
- Product information: Firefly G5 panel-level packaging inspection and 3D metrology
- Technical reference: 2D/3D inspection and metrology for large-area panels (PDF)
- Product information: Dragonfly G3 2D/3D inspection and metrology for advanced packaging
- Technical reference: Dragonfly G3 subsurface inspection announcement
- Technical reference: JetStep panel RDL projection lithography (PDF)
- Product information: EchoScan immersion-free bond-void inspection
Contact information
Contact the supplier directly through its official channels.
United States · Headquarters
Onto Innovation — Wilmington Headquarters
- Phone
- +1 978 253 6200
Official source ↗Source checked
Taiwan · Supplier office
Onto Innovation — Hsinchu Office
- Phone
- +886 3 5712055
Official source ↗Source checked
Mainland China · Supplier office
Onto Innovation — Shanghai Office
- Phone
- +86 21 6093 0600
Official source ↗Source checked
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