Firefly G5 panel-level packaging inspection and 3D metrology

Onto Innovation · Warpage, topography and stress metrology

Purpose: Inspect residue, pattern and embedded defects on advanced IC substrates and packaging panels, alongside critical 3D dimensions.
Technical approach: Combines Clearfind inspection, infrared and color imaging, and 2D/3D metrology to support process analysis.
Scope of use: Targets advanced IC substrates, fan-out panels, interposers and embedded-die substrates; defect coverage depends on the sample.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Public information does not establish full-field warpage measurement through thermal cycling or detection of every internal defect.
What to prepare
Prepare sample materials, dimensions and surface details, known-defect samples or images, dimensional tolerances and line throughput targets.
Confirm with the supplier
Ask about sample compatibility, detection and false-call performance, repeatability, configuration and production-data interfaces.
Public evidence: The indexed official page lists these inspection and metrology modes. Direct access to the page and supporting paper was unavailable during this review.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.