JetStep panel RDL projection lithography

Onto Innovation · Process equipment and thermal control

Purpose: When die shift affects RDL alignment, compare panel exposure and the workflow that incorporates measured die positions.
Technical approach: JetStep uses mask-projection step-and-repeat exposure. Onto describes Firefly supplying die-location data to X500 through StepFAST.
Scope of use: X500 addresses rectangular-panel advanced-packaging lithography and RDL; confirm resist, panel condition and coordinate interfaces for the project.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Exposure adjustment does not physically relocate shifted dies. Public sources do not guarantee project overlay or electrical yield; historical orders do not confirm current availability.
What to prepare
BLNKK suggests preparing die-shift maps, panel topography, resist thickness, overlay tolerance and validation of coordinate conversion and exposed patterns.
Confirm with the supplier
Confirm available configuration, substrate/resist suitability, position-data interface, compensation approach and sample alignment validation.
Public evidence: The annual report describes panel RDL and this workflow; a dated 2022 official release provides historical order evidence.

Supporting references

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