EchoScan immersion-free bond-void inspection

Onto Innovation · Process equipment and thermal control

Purpose: Evaluate interface-void inspection after die or wafer bonding.
Technical approach: Onto describes non-contact, immersion-free void detection in atmosphere.
Scope of use: Announced for wafer and hybrid bonding; stack compatibility, configuration and availability need confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
The release does not disclose complete detection physics or sample conditions. Void signals alone do not determine chemical causes or bond strength.
What to prepare
BLNKK suggests preparing stack/interface details, defect criteria and known-defect samples for sensitivity and coordinate checks.
Confirm with the supplier
Confirm current configurations, supply, sample-specific detectable size and scan conditions, validation and data outputs.
Public evidence: The January 14, 2025 news release describes introduction to selected customers, not established current general availability.

Contact the supplier

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