EEJA MICROFAB Au gold bump plating chemistry
EEJA Ltd. · Material properties and interface engineering
- Purpose
- Gold-bump height comparisons need plating chemistry assessed with resist openings and current distribution.
- Technical approach
- MICROFAB Au is non-cyanide wafer gold-plating chemistry for bumps and fine patterns.
- Scope of use
- Consider actual gold-bump processes; confirm grades separately for bumps, wiring and via filling.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsIt is not a general copper-pillar or solder-bump formulation or a repair for completed bumps. Chemistry alone does not ensure uniform wafer-level height.
What to prepareBLNKK suggests preparing seed/resist structures, target heights, bath and current/flow records, with height maps and surface comparisons.
Confirm with the supplierConfirm the grade, bath management and process window, and sample validation of height, adhesion and contact performance.
- Public evidence
- The official TANAKA page lists MICROFAB Au bump applications and named grades, sold by EEJA.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.