EEJA MICROFAB Au gold bump plating chemistry
Gold-bump height comparisons need plating chemistry assessed with resist openings and current distribution.
EEJA Ltd.
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- Semiconductor precious-metal plating chemistry.
Other names: EEJA · Electroplating Engineers of Japan
Applications: Gold bump formation/height comparison
Catalog solutions · 1
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The Japan contact and form cover EEJA precious-metal plating chemicals and related products. Specify the packaging application and material needed. Plating equipment is operated separately by EEJA Technologies; overseas inquiries may be routed through TANAKA/Metalor group companies. Official source ↗
Japan · Supplier office
EEJA Ltd. — Hiratsuka Office
- Phone
- +81 463 32 8131
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