CIRCL-AP all-surface inspection and 2D/3D metrology for wafer-level packaging
KLA · Warpage, topography and stress metrology
- Purpose
- Thinning, bonding and RDL/TSV process excursions can affect the wafer front, back and edge, requiring tracking of surface defects alongside bump and interconnect dimensional variation.
- Technical approach
- A multi-module cluster combines front, back and edge inspection with optical review. Selected modules provide lateral-dimension and height metrology for bumps, RDLs or TSVs.
- Scope of use
- KLA lists WLCSP, FOWLP and 2.5D/3D wafer-level process control, with support for bonded, thinned and warped substrates. Coverage depends on the modules and sample configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsHandling warped substrates does not establish warpage measurement through a thermal cycle. Modules and recipes cover different defects and measurements; surface inspection does not directly diagnose every buried bonding defect.
What to prepareBring wafer size/thickness, carrier/bonding state and warp range, plus defect types, affected surfaces, critical dimensions and inspection points. Include representative samples and throughput targets.
Confirm with the supplierConfirm current modules, handling limits and 2D/3D measurement coverage. Use samples to discuss sensitivity, false calls, repeatability and throughput, with a plan for data integration and recipe validation.
- Public evidence
- The 2015 launch describes development and production use. The current page lists front, edge, backside and review modules; the 2025 annual report lists CIRCL-AP. Historical module names do not establish today's supplied configuration.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.