Profilm3D white-light interferometry for surface topography and bow

Filmetrics, a KLA company · Warpage, topography and stress metrology

Purpose: Measure visible bump heights, coplanarity, step heights and roughness to compare local height distributions and surface form.
Technical approach: White-light and phase-shifting interferometry reconstruct 3D surfaces; imaging modes suit different surfaces and optional stitching extends coverage.
Scope of use: For local or multisite die, RDL, film, MEMS and package-surface measurements, with sample-appropriate stages and fixtures.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Accessible optical signals are needed; buried or obscured bumps need other assessment. Vertical resolution is not accuracy across a stitched surface.
What to prepare
BLNKK suggests preparing bump geometry/materials, sample height and measurement area, plus coplanarity references, leveling rules and calibration standards.
Confirm with the supplier
Confirm objectives, imaging/stitching options and sample-based reflectivity, slope, repeatability, coverage and fixture deformation.
Public evidence: The current page and 2022 brochure describe bump coplanarity, surface bow and automated stages; stage travel does not guarantee whole-wafer coverage.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.