Profilm3D white-light interferometry for surface topography and bow
Measure visible bump heights, coplanarity, step heights and roughness to compare local height distributions and surface form.
Filmetrics
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- Profilm3D white-light interferometry for surface topography and bow · Warpage, topography and stress metrology
- Filmetrics F20 resist and dielectric thickness comparison · Engineering measurement and characterization
Other names: Filmetrics, a KLA company
Applications: Wafers, dies, RDL, films and MEMS · RDL resist and dielectric films · Representative seed/metal films
Catalog solutions · 3
Filmetrics F20 resist and dielectric thickness comparison
RDL process review needs to separate photoresist/dielectric thickness variation from line-shape abnormalities.
Filmetrics R54 metal-film sheet-resistance comparison
Compare representative metal-film sheet resistance and uniformity separately from via-contact resistance.
Candidates in engineering problem guides
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- Filmetrics F20 resist and dielectric thickness comparison · RDL line-to-line shorts after fabrication →
- Filmetrics R54 metal-film sheet-resistance comparison · High initial RDL via contact resistance →
- Profilm3D white-light interferometry for surface topography and bow · Microbump height variation and coplanarity →
Public sources
Contact information
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United States · Supplier office · Sales inquiries
Filmetrics (KLA Instruments) — U.S. Sales and Applications
- Phone
- +1 858 573 9300
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Company contact · General contact · Technical support
KLA Instruments — Global Support Contact Center
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