TOK PMER P-BK bump-plating resist

Tokyo Ohka Kogyo Co., Ltd. · Material properties and interface engineering

Purpose: Bump-height uniformity comparisons need coordinated checks of resist thickness, opening profiles and plating conditions.
Technical approach: PMER P-BK is a positive-tone thick resist for Cu-pillar and microbump plating molds, with continuous Cu/Ni/SnAg plating applications.
Scope of use: For bump formation with grade, thickness, underlayer, lithography and bath matched to layout and target height.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Resist profiles do not guarantee plated-height uniformity. Examples are not universal bath recipes, and resist cannot repair completed bumps.
What to prepare
BLNKK suggests gathering target geometry, layout density, thickness/opening measurements, lithography histories, bath/current conditions and height distributions.
Confirm with the supplier
Confirm grade, thickness, adhesion, exposure/development and bath compatibility, plus stripping and sample height/residue acceptance.
Public evidence: The named P-BK section lists 20–65 µm resist thickness and process examples; plated heights still need measurement on the intended device.

Contact the supplier

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