AP300 Cu-pillar/bump resist patterning

Veeco · Process equipment and thermal control

Purpose: Bump-process comparisons need resist openings, overlay and sidewalls checked before plating.
Technical approach: AP300 patterns packaging resist through customizable Unity lithography configurations.
Scope of use: Veeco lists copper pillars, flip-chip bumping and FOWLP; confirm thick-resist, optics and wafer-format needs.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Exposure is not plating/reflow or bridge repair. Announcements do not establish stack-specific resist, overlay or formed-bump acceptance windows.
What to prepare
BLNKK suggests preparing resist stacks, openings/sidewalls, overlay maps, exposure settings and downstream plating/reflow/bump measurements.
Confirm with the supplier
Confirm optics/wafer configurations, resist exposure windows, overlay definitions and pattern acceptance; discuss correlation with height and bridging inspections.
Public evidence: The 2025 announcement identifies uses; the 2019 release explains Unity and pattern-control roles.

Supporting references

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