WaferStorm advanced-packaging wet processing
Flux, resist or via residues can affect downstream processing. Cleaning methods need to be assessed against the residues and exposed packaging materials.
Veeco
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- Lithography · laser annealing · deposition and wet process equipment
Applications: Advanced-packaging residue removal · Cu-pillar / flip-chip-bump resist
Catalog solutions · 2
AP300 Cu-pillar/bump resist patterning
Bump-process comparisons need resist openings, overlay and sidewalls checked before plating.
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Contact information
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The form includes quote, product information and support requests. Taiwan and China are regional contacts; the US phones separately cover advanced packaging lithography and wet processing. Specify AP300, WaferStorm or the equipment you need. Official source ↗
United States · Supplier office · Sales inquiries
Veeco — Laser Annealing and Advanced Packaging Lithography
- Phone
- +1 408 3218835
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Veeco Taiwan
- Phone
- +886 3 5646888
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Veeco China — Shanghai
- Phone
- +86 21 68629820
Official source ↗Source checked
More regional contacts (1)
United States · Supplier office · Sales inquiries
Veeco — Wet Processing Technologies
- Phone
- +1 215 3280700
Official source ↗Source checked
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