WaferStorm advanced-packaging wet processing

Veeco · Process equipment and thermal control

Purpose: Flux, resist or via residues can affect downstream processing. Cleaning methods need to be assessed against the residues and exposed packaging materials.
Technical approach: ImmJET combines multi-wafer immersion with high-pressure spray for wet cleaning and stripping. Confirm chemistry, sequence and handling for the intended samples.
Scope of use: Veeco lists flux cleaning, photoresist/dry-film stripping and via cleans for advanced packaging. Confirm the recipe for your material stack.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Announcements establish applications and mechanism, not universal material compatibility. Residue removal does not establish lower contact resistance or higher bonding yield.
What to prepare
BLNKK suggests residues, upstream processing, via geometry, exposed materials, wafer format and permitted chemistry/damage limits, with before/after surface and electrical results.
Confirm with the supplier
Confirm trial recipe, immersion/spray setup, compatibility, handling and acceptance criteria. For RDL vias, agree on residue, metal-damage and contact-performance checks.
Public evidence: The November 2024 order announcement lists applications; the August 2024 IBM development announcement explains immersion/spray and the collaboration.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.