EagleT-AP 2D/3D inspection and metrology for micro-bumps
Camtek · Warpage, topography and stress metrology
- Purpose
- Identifies height, coplanarity, dimensional, placement and surface-defect deviations in dense bumps, Cu pillars and RDL for advanced-packaging process control.
- Technical approach
- Combines optical channels, LED illumination, CAD-based detection and 3D metrology to inspect interconnect geometry and surfaces on one platform.
- Scope of use
- Supports wafer inspection/metrology of micro-bumps, Cu pillars, RDL, PI/PR and via openings. Confirm suitability for specific hybrid-bonding structures with the supplier.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsBump-size capability is not a same-size defect-detection guarantee or full-field thermal-warpage measurement. Validate precision, coverage and cycle time on the actual materials, structures and recipe.
What to prepareBring wafer dimensions, interconnect geometry/CAD, surface materials, target defects and tolerances, plus reference measurements or representative good/bad samples.
Confirm with the supplierConfirm precision, repeatability, detection/false-call performance and wafer cycle time. For hybrid bonding, ask for model-specific surface/defect coverage and validation evidence.
- Public evidence
- Camtek lists bumps down to 2 µm, 50 million bump measurements per wafer, and height, coplanarity, RDL and via functions. These statements do not guarantee precision or throughput for every sample.
Supporting references
Contact the supplier
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.