EagleT-AP 2D/3D inspection and metrology for micro-bumps
Identifies height, coplanarity, dimensional, placement and surface-defect deviations in dense bumps, Cu pillars and RDL for advanced-packaging process control.
Camtek
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- Inspection and metrology for advanced packaging and compound semiconductor
Applications: Micro-bump, Cu pillar, RDL, PI/PR and via openings · RDL photoresist and wafer patterns
Catalog solutions · 2
MicroProf AP photoresist thickness and profile comparison
RDL lithography review needs photoresist thickness, uniformity and profile comparisons before downstream processing.
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Contact information
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Taiwan · Supplier office
Camtek Inspection Technology Limited (CITL)
- Phone
- +886 3 575 3466
Official source ↗Source checked
Taiwan · Supplier office
Camtek Inspection Technology Limited — General Manager (Simon Liu)
- simon_l@camtek.com
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Taiwan · Supplier office · Technical support
Camtek Inspection Technology Limited — Service (Devin Lin)
- devin_l@camtek.com
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