MicroProf AP photoresist thickness and profile comparison

Camtek · Engineering measurement and characterization

Purpose: RDL lithography review needs photoresist thickness, uniformity and profile comparisons before downstream processing.
Technical approach: MicroProf AP automates configurable multi-sensor wafer metrology; interferometric and confocal-chromatic sensing provide thickness and surface information.
Scope of use: Photoresist coatings and patterns need validated sensors/recipes for their optical properties and geometry.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Capability depends on sensors, optical models and patterns. Photoresist profiles alone do not establish electrical shorts or plating/seed-removal root causes.
What to prepare
BLNKK suggests preparing resist material, thickness/pattern dimensions, wafer sampling locations, process history and reference cross-sections or electrical results.
Confirm with the supplier
Confirm sensors, recipes, optical parameters and calibration; discuss repeatability at pattern edges, thickness variations and automated sampling locations.
Public evidence: Camtek lists photoresist processes; its white paper explains MicroProf multi-sensor metrology and AP automation.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.