WAFERinspect AOI Dual 3D wafer inspection

Confovis · Warpage, topography and stress metrology

Purpose: Uses 3D optical metrology to compare wafer-bump height, coplanarity and visible anomalies for height-distribution analysis.
Technical approach: A chromatic line sensor scans the wafer first, followed by detailed Confocam confocal inspection; the sensors have independent Z axes.
Scope of use: For bumps, microlenses and advanced-packaging surfaces, with inspection conditions selected for geometry and surface.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Surface data does not establish buried voids. Typical scan time is not total inspection cycle; resolution/repeatability need sample validation.
What to prepare
BLNKK suggests bump dimensions/layout, materials/finish, reference plane, height criteria and representative good/defective samples.
Confirm with the supplier
Confirm reflectivity/occlusion suitability, two-stage recipes, repeatability/uncertainty and full cycle including detailed inspection.
Public evidence: The AOI Dual page explains the two-sensor workflow; Confovis’ bump application page lists height, coplanarity and volume measurements.

Supporting references

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