WAFERinspect AOI Dual 3D wafer inspection
Uses 3D optical metrology to compare wafer-bump height, coplanarity and visible anomalies for height-distribution analysis.
Confovis
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- Optical 3D surface metrology for semiconductor and microelectronics
Applications: Wafer bumps / microlenses
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Germany · Headquarters
confovis GmbH — Jena Headquarters
- info@confovis.com
- Phone
- +49 3641 27410 00
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