INTERVIA 9000 copper plating — Qnity, formerly DuPont
DuPont · Material properties and interface engineering
- Purpose
- RDL and copper-pillar plating must match pattern geometry and deposition conditions. INTERVIA 9000 is a candidate chemistry for comparing bath integration.
- Technical approach
- Copper bath chemistry and additives control deposition. Qnity describes a shared bath for RDL and copper pillars; exact components need confirmation.
- Scope of use
- Targets fan-in/fan-out wafer-level packaging. Current product information is published by Qnity; this record retains its historical DuPont catalogue association.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsAn individual additive is not a complete bath. Mixed item names on the page require clarification; shared-bath claims do not qualify uniformity, filling or supply.
What to prepareBLNKK recommends preparing pattern/resist/seed geometry, target deposits, current bath and electrical/agitation conditions. Include height and thickness distributions for comparison planning.
Confirm with the supplierAsk Qnity for exact SKUs, bath components, current technical data and regional supply. Confirm equipment compatibility, additive monitoring and shared-bath operating/validation conditions.
- Public evidence
- The product page describes these applications; a 2025 announcement confirms separation from DuPont. Publicly read content does not supply a complete recipe or customer-pattern qualification.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.