INTERVIA 9000 copper plating — Qnity, formerly DuPont
RDL and copper-pillar plating must match pattern geometry and deposition conditions. INTERVIA 9000 is a candidate chemistry for comparing bath integration.
DuPont
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- Advanced packaging dielectrics · adhesives · thermal and interconnect materials
Applications: RDL / copper pillars
Catalog solutions · 1
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INTERVIA electronic materials are now offered by Qnity. The contacts below are for Qnity. Official source ↗
United States · Headquarters
Qnity Electronics, Inc. — Wilmington Headquarters (formerly DuPont Electronics & Industrial)
- Phone
- +1 302 294 4651
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