MacDermid Alpha Systek SCP 100 copper pillar plating

MacDermid Alpha Electronics Solutions · Process equipment and thermal control

Purpose: Bump-height variation needs pillar-process and measured height-distribution comparisons.
Technical approach: Systek SCP 100 copper-pillar chemistry targets deposition flatness, thickness control and coplanarity in panel-level packaging.
Scope of use: A material candidate for compatible patterned pillars, seed layers and plating equipment.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published deposition speed does not guarantee pattern-specific height uniformity. Chemistry neither measures height nor automatically levels a panel; other PLP products’ features do not transfer.
What to prepare
BLNKK suggests recording mask/density, seed, bath, current, agitation and panel contacts, with location-matched height measurements.
Confirm with the supplier
Confirm pattern/thickness range, process window, resist/seed compatibility, and methods for validating panel- and die-level coplanarity.
Public evidence: The named FAQ describes SCP 100 deposition/coplanarity control, without a target-panel uniformity tolerance.

Contact the supplier

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