PackageBond copper-polymer adhesion promotion for panel-level packaging
Compare adhesion treatments once delamination has been located at a copper/polymer interface.
MacDermid Alpha Electronics Solutions
Explore the supplier’s public information and its documented technical solutions.
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- Solder, sintering, plating and semiconductor assembly materials
Applications: PLP, reconstituted panels and RDL interfaces · Power semiconductors / die attach · Panel-level copper pillar formation · Panel-level copper via-fill comparison
Catalog solutions · 4
ALPHA Argomax 2020 silver-sinter die-attach paste
A power die-attach sintering window depends on paste, both metallized surfaces and the bonding history, not the material name alone.
MacDermid Alpha Systek SCP 100 copper pillar plating
Bump-height variation needs pillar-process and measured height-distribution comparisons.
MacDermid Alpha Systek VTP 100 via-fill/RDL plating
Copper-fill void comparisons need controlled via geometry, seed and plating conditions.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- PackageBond copper-polymer adhesion promotion for panel-level packaging · New delamination after reflow in moisture-exposed packages →
- MacDermid Alpha Systek VTP 100 via-fill/RDL plating · Internal voids in substrate microvia copper fill →
- MacDermid Alpha Systek SCP 100 copper pillar plating · Microbump height variation and coplanarity →
- ALPHA Argomax 2020 silver-sinter die-attach paste · Densification window for silver-sintered attachment →
Public sources
Contact information
Contact the supplier directly through its official channels.
United States · Supplier office · Technical support
MacDermid Alpha — Americas Semiconductor Assembly Customer Service
- Phone
- +1 800 367 5460
Official source ↗Source checked
Singapore · Supplier office · Technical support
MacDermid Alpha — APAC Semiconductor Assembly Customer Service
- Phone
- +65 6861 1977
Official source ↗Source checked
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