PackageBond copper-polymer adhesion promotion for panel-level packaging
MacDermid Alpha Electronics Solutions · Material properties and interface engineering
- Purpose
- Compare adhesion treatments once delamination has been located at a copper/polymer interface.
- Technical approach
- Supplier-described patented chemistry promotes copper/polymer adhesion; formulation and complete processing conditions are not published.
- Scope of use
- For large multi-die reconstituted panels, with supplier-described conveyorized or batch processing.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsImproved interface adhesion does not guarantee global panel-warpage improvement. MSL-1 claims need the actual stack and test conditions.
What to prepareBLNKK suggests preparing delamination location, copper/polymer types, pretreatment and process sequence, moisture/reflow histories and reference samples.
Confirm with the supplierRequest grade, treatment/cleaning conditions, compatibility and reliability-test stack, protocol, acceptance criteria and data.
- Public evidence
- The page gives HVM and MSL-1 claims without stack or test conditions; supporting details need supplier confirmation.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.