TATSUTA TG bonding and bumping wire
TATSUTA Electric Wire and Cable Co., Ltd. · Material properties and interface engineering
- Purpose
- Wire-fatigue or wire-bump height comparison needs pads, formation conditions and geometry correlated.
- Technical approach
- TG gold wire forms bonded interconnects; TG-B/RB separately serves wire-formed bumps.
- Scope of use
- Select bonding grades for loop and package geometry; confirm bump feedstock and forming conditions separately.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsStable-loop or bump-height descriptions do not qualify the actual height distribution or fatigue life. Properties are not interchangeable across TG grades.
What to prepareBLNKK suggests preparing pad metallurgy, wire/loop or bump geometry, tooling and process history, with height maps, pull/shear failure locations and cycling loads.
Confirm with the supplierConfirm the grade, ball/cut/bonding window and assessment of height consistency, interface strength and cyclic reliability.
- Public evidence
- The official lineup distinguishes TG loop types and TG-B/RB bumping wire, with qualitative series-specific features.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.