Micross AIT wafer bumping and RDL services

Micross Components · Process equipment and thermal control

Purpose: Bare-die interconnect development needs bumping, redistribution and fabrication choices. Micross AIT provides an outsourced wafer-bumping/RDL route for comparison.
Technical approach: Services include WLCSP ball placement, electroplated C4, copper pillars and single/multilayer Cu RDL with polymer repassivation. Match processing to the commissioned design.
Scope of use: This WLP page describes a facility supporting wafers up to 200 mm, from development to low/mid-volume production. Confirm other formats or lines separately.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
The named 200 mm line does not establish all Micross formats. Separate fine-pitch metal-bond demonstrations are not routine specifications for this bumping service.
What to prepare
BLNKK recommends preparing wafer format, pad metals/pitch, bump/RDL stacks, target height and volume. Include height measurement, reliability and yield acceptance needs.
Confirm with the supplier
Confirm the assigned line, wafer format, design rules, materials and processes. Agree on metrology, coupons, delivered records, qualification and rework conditions.
Public evidence: The website and 2024 WLP flyer document bumping, RDL and custom test vehicles. They do not qualify customer height distribution or yield.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.