Micross AIT wafer bumping and RDL services
Bare-die interconnect development needs bumping, redistribution and fabrication choices. Micross AIT provides an outsourced wafer-bumping/RDL route for comparison.
Micross Components
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Packaging · testing · qualification and high-reliability microelectronics
Applications: Wafer bumping / redistribution · Accepted wafer test specimens · Accepted finished BGAs
Catalog solutions · 3
Micross matched thinning and dicing service
Grinding-damage comparisons need samples from thinning, polishing and dicing stages to locate when defects arise.
Micross finished-BGA reballing and alloy conversion
Assess finished-BGA reballing or alloy conversion while distinguishing original ball geometry and thermal history from reworked results.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Micross matched thinning and dicing service · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- Micross finished-BGA reballing and alloy conversion · Package solder-ball coplanarity and initial contact →
- Micross AIT wafer bumping and RDL services · Microbump height variation and coplanarity →
Public sources
Contact information
Contact the supplier directly through its official channels.
The Taiwan contacts are manufacturer-listed representatives; confirm which products and services they handle. For wafer bumping, thinning or reballing, use the manufacturer’s form and select AIT, Die & Wafer or Component Modification. The listed U.S. sales contact covers North, South and Central America. Official source ↗
United States · Supplier office · Sales inquiries
Micross — North, South and Central America Sales; Erik Everett
- Phone
- +1 303 517 2026
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
Bentech Computer Corp. — Micross Authorized Representative; Emily Hsiao
- Phone
- +886 2 2695 8906
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Micross — China Country Manager, Eric Zhang
- Phone
- +86 21 5459 1970
Official source ↗Source checked
More regional contacts (1)
Taiwan · Supplier-listed distributor · Sales inquiries
E-Elements Technology Co., Ltd. — Micross Authorized Representative; Young Wang
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.